TSMC's Fab 22 Set for N2 Chip Production in 2026; Rumors Swirl Around 'Fab 25'
Taiwan Semiconductor Manufacturing Company (TSMC) is preparing for substantial advancements in its chip manufacturing capabilities. Fab 22, its Kaohsiung facility, is expected to be ready for N2 chip production by the second quarter of 2026. Meanwhile, rumors circulate about a potential 'Fab 25' project in Taichung, although official information remains scarce.
Fab 22's Phase 2 is on track to meet the 2026 deadline for N2 chip production. Notably, TSMC's A16 production will include backside power delivery (BSPD), a feature absent in the initial A14 production run. The first wafers in Fab 22's Phase 1 have already undergone the N2 process, paving the way for mass production in 2026.
Originally planned to support older processes around 7nm and 28nm in 2021, Fab 22's focus shifted to N2 production due to evolving market demands. TSMC is also expanding Fab 22 with a sixth phase for A14 production, further bolstering its capabilities.
Rumors hint at a potential 'Fab 25' project in Taichung, with four phases planned for A14 production. However, official announcements from TSMC or other sources remain elusive, leaving the project's status uncertain.
In summary, TSMC's Fab 22 is progressing steadily towards N2 chip production by mid-2026, with A16 production set to include BSPD. Meanwhile, whispers of a 'Fab 25' project in Taichung persist, but concrete details and official confirmation are yet to materialise. As always, the semiconductor industry's landscape continues to evolve, with new developments and projects emerging regularly.
