USI to Introduce 1.6 Terabyte Optical Device
Universal Scientific Industrial (USI) is making a significant stride in the tech industry with its latest innovation - a 1.6 Terabits per second (Tbps) optical module. This cutting-edge technology is designed specifically for AI-driven and high-performance computing (HPC) data centers.
The 1.6T optical module boasts several key advancements. It doubles the transmission speed of current mainstream 800G modules, achieving a data rate that is twice as fast. This speed complies with the IEEE 802.3dj standard, ensuring compatibility with existing infrastructure.
USI's precision manufacturing capabilities play a crucial role in the module's performance. The company uses Flip-Chip Bonder equipment for high-precision die bonding and automated fiber alignment systems for nanometer-level fiber alignment accuracy. This precision is essential for maintaining signal integrity at such high data speeds.
USI's vertical integration approach allows for customization of the optical assembly to meet specific customer needs. The company optimizes UV glue parameters for the optical assembly and operates with a broad vertical integration approach, including an in-house testing laboratory. This laboratory speeds up product validation and reduces time-to-market, ensuring resilience against supply chain disruptions.
Automated fiber alignment and high-precision manufacturing also improve production yields and efficiency, helping to reduce costs while scaling output to meet growing data center demands.
Mr. Leo Tai, Associate Vice President of USI's R&D Center, has stated that the growing demand for higher-speed data transmission, driven by AI computing workloads, is a key factor in the development of this technology. USI aims to demonstrate its strength in advanced packaging and high-speed module integration with this innovation.
The company also emphasizes the importance of fiber alignment for the performance of the optical assembly. USI has mastered the art of UV glue parameter optimization for the optical assembly and will implement automated fiber alignment in mass production for increased efficiency.
In addition, USI is establishing an in-house testing laboratory for optical module testing and measurement. This laboratory will enable comprehensive optical module validation and accelerate development verification, further solidifying USI's position as a leader in the tech industry.
[1] IEEE 802.3dj Standard: https://ieeexplore.ieee.org/document/8891983 [2] USI Press Release: https://www.usi.com/news/usi-unveils-1-6t-optical-module-for-next-generation-data-centers [5] Next-Generation Data Centers: https://www.datacenterdynamics.com/content-hub/next-generation-data-centers
Data-and-cloud-computing advancements are evident in USI's latest innovation, a 1.6T optical module designed for AI-driven and high-performance computing (HPC) data centers, highlighting the company's commitment to technology. With precision manufacturing capabilities and the use of Flip-Chip Bonder equipment, USI ensures nanometer-level fiber alignment accuracy needed for maintaining signal integrity at such high data speeds.
